|
Product Details:
|
| Product: | E-ink Panel 2.66" | Resolution: | 152x296 Dots Resolution |
|---|---|---|---|
| Display Mode: | Active Matrix Electrophoretic Display(AM EPD) | Color: | Black/White/Red |
| Optics: | All Viewing Angles | Outline Dim.: | 71.82(H) X 36.3(V) X 1.0(T) Mm |
| Active Area: | 60.088(H) X 30.704(V) Mm | Pin Number: | 24 Pins |
| Interface: | SPI Interface | Compliance: | REACH & RoHS Compliant |
| Highlight: | RoHS E Ink Panel,2.66 Inch E Ink Panel,SPI Interface Electronic Paper Display |
||
3 colors EPD 2.66 inch Screen, 2.66" E-ink ESL Display Description
SAEF Technology SFEPD213BWR-7018A01 is a 3-Colors 2.66” a-Si, active matrix TFT, Electronic Paper Display (EPD) panel. The panel has such high resolution (125dpi) that it is able to easily display fine patterns. Due to its bi-stable nature, the EPD panel requires very little power to update and needs no power to maintain an image.
Features
1. a-Si TFT active matrix Electronic Paper Display(EPD)
2. Three colors support: White, Black, Red
3. Resolution: 296 x 152
4. Ultra-low power consumption
5. Super Wide Viewing Angle - near 180°
6. Extra thin & light
7. SPI interface
8. RoHS compliant
| Item of general information | Contents |
| Screen Size |
2.66 inch |
| Display Mode | Active Matrix EPD |
| Display Resolution | 152(H)×296(V) Pixels |
| Active Area | 60.088(H) x 30.704(V) mm |
| Pixel Pitch | 0.203 x 0.202 (125dpi) |
| FPL (Front Plane Laminate) | Spectra Red 2.0 |
| Outline Dimension | 71.82(H) x 36.3(V) x 1.0(T) mm |
| Weight | 6.2 g |
| Logic supply voltage | 3.0V typical |
| Operation Temperature | 0°C to +50°C |
| Storage Temperature | -25°C to +60°C |
| Interface | SPI |
| Compliance | REACH & RoHS Compliant |
Application
Electronic Shelf Label System
Pin Definition
Pin1, NC Not connected
Pin2, GDR / O / Power MOSFET Driver control, this pin is the N-Channel MOSFET Gate Drive Control.
Pin3, RESE / I / Booster Control Input, this pin is the Current Sense Input for the Control Loop.
Pin4, NC Do not connect with other NC pins
Pin5, VSH2 / C / Capacitor. This pin is the Positive Gate driving voltage and the Power Supply pin for VSH2 A stabilizing capacitor should be connected between VSH2 and GND.
Pin6, NC Not connected
Pin7, NC Not connected
Pin8, BS1 / I / VSS, This pin is setting panel interface.
Pin9, BUSY / O / Device Busy Signal, This pin is Busy state output pin. When Busy is High, the operation of the chip should not be interrupted, and Command should not be sent.
Pin10, RES# / I / System Reset, This pin is reset signal input. Active Low.
Pin11, D/C# / I / This pin is Data/Command control
Pin12, CS# / I / This pin is the chip select.
Pin13, SCL / I / Serial communication clock input.
Pin14, SDA / I / Serial communication data input/output.
Pin15, VDDIO / P / Power for interface logic pins& I/O. It should be connected with VCI.
Pin16, VCI / P / Power Supply for the chip
Pin17, GND / P / Ground
Pin18, VDDD / C / Internal regulator output A capacitor should be connected between VDD and GND.
Pin19, VPP / P / Power Supply for OTP Programming
Pin20, VSH / C / This pin is the Positive Source driving voltage. A stabilizing capacitor should be connected between VSH and GND.
Pin21, VGH / C / A stabilizing capacitor should be connected between VGH and GND.
Pin22, VSL / C / This pin is the Negative Source driving voltage and the Power Supply pin for VCOM. A stabilizing capacitor should be connected between VSL and GND.
Pin23, VGL / C / A stabilizing capacitor should be connected between VGL and GND.
Pin24, VCOM / C / This pin is the VCOM driving voltage A stabilizing capacitor should be connected between VCOM and GND.
Typical Operating Sequence
MCU Interface selection In this module , there are 4-wire SPI and 3-wire SPI that can communicate with MCU. The MCU interface mode can set by hardware selection on BS1 pins. When it is “Low ”,4-wire SPI is selected. When it is “High”,3-wire SPI(9 bits SPI) is selected.
MCU Serial Interface (4-wire SPI) The 4-wire SPI consists of serial clock SCL, serial data SDA,D/C#,CS#,In SPI mode,D0 acts as SCL, D1 acts as SDA.
MCU Serial Interface (3-wire SPI) The 3-wire serial interface consists of serial SCL,serial data SDA and CS#. In 3-wire SPI mode,D0 acts as SCL ,D1 acts as SDA,The pin D/C# can be connected to an external ground. The operation is similar to 4-wire serial interface while D/C# pin is not used. There are altogether 9-bits will be shifted into the shift register on every ninth clock in sequence: D/C# bit , D/C bit, D7 to D0 bit,The D/C# bit (first bit of the sequential data )will determine the following data byte in shift register is written to the Display Data RAM(D/C# bit =1 ) or the command register (D/C# bit = 0 ). Under serial mode , only write operations are allowed.
Precaution
(1) The EPD Panel / Module is manufactured from fragile materials such as glass and plastic, and may be broken or cracked if dropped. Please handle with care. Do not apply force such as bending or twisting to the EPD panel.
(2) It is recommended to assemble or install EPD panels in a clean working area. Dust and oil may cause electrical shorts or degrade / scratch / dent the protection sheet film.
(3) Do not apply pressure to the EPD panel in order to prevent damaging it.
(4) Do not connect or disconnect the interface connector while the EPD panel is in operation.
(5) Please support the bezel with your finger while connecting the interface cable such as the FPC.
(6) Do not stack the EPD panels / Modules. (7) Do not press the FPC on the glass edge or Pull FPC up / down to 90°.
(8) Do not touch the FPC lead connector.
(9) Do not touch IC bonding area. It may scratch TFT lead or damage IC function.
(10) Wear a Wrist Strap (Grounding connect) when handling and during assembly. Semiconductor devices are included in the EPD Panel / Module and they should be handled with care to prevent any electrostatic discharge (ESD). (An Ion Fan may be needed in assembly operation to reduce ESD risk.)
(11) Keep the EPD Panel / Module in the specified environment and original packing boxes when storage in order to avoid scratching and keep original performance.
(12) Do not disassemble or reassemble the EPD panel.
(13) Use a soft dry cloth without chemicals for cleaning. Please don’t press hard for cleaning because the surface of the protection sheet film is very soft and without hard coating. This behavior would make dent or scratch on protection sheet.
(14) Please be mindful of moisture to avoid its penetration into the EPD panel, which may cause damage during operation.
(15) It’s low temperature operation product. Please be mindful the temperature different to make frost or dew on the surface of EPD panel. Moisture may penetrate into the EPD panel because of frost or dew on surface of EPD panel, and makes EPD panel damage.
(16) High temperature, high humidity, sunlight or fluorescent light may degrade the EPD panel’s performance. Please do not expose the unprotected EPD panel to high temperature, high humidity, sunlight, or fluorescent for long periods of time. Please store the EPD panel in controllable environment of warehouse and original package: Without sunlight, without condensation, a temperature range of 15ºC to 35ºC, and humidity from 30%RH to 60%RH.
(17) The label ink used for marking the Panel ID number is erased easily by solvent. Please avoid using solvent to clean the EPD panel.
(18) The EPD is vacuum packed.
(19) Before approved by BOE and customer, products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
(20) BOE makes every attempt to ensure that its products are of high quality and reliability. However, contact SAEF sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
(21) Design your application so that the product is used within the ranges guaranteed by BOE particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. BOE bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail safes, so that the equipment incorporating BOE product does not cause bodily injury, fire or other consequential damage due to operation of the BOE product.
(22) This product is not designed to be radiation resist.
3 colors EPD 2.66 inch Screen, 2.66" E-ink ESL Display Drawing
3 colors EPD 2.66 inch Screen, 2.66" E-ink ESL Display Product Image
CONTACT
Welcome to inquire via ck@saef.com.cn
Search Keyword: EPD 2.66 inch, 2.66 inch E-ink display, ESL display 2.66 inch, Epaper 2.66 inch, E-inch 2.66"
Contact Person: Cologne Ke
Tel: +8613502983321
Fax: 86-755-2370-9419
